| 摘要 |
PURPOSE:To remove lugs generated on the surface of a substrate in the previous process by polishing a magnetic disk substrate with abrasive grains smaller in size than those used in the previous process after applying the process which rotates it and presses a lapping tape to the substrate face with a pressing roller. CONSTITUTION:Abrasive grains smaller in size than those used in the previous process are used in the second process. A tape 3 is pressed to a rotating disk substrate 1 by a rubber roll 2 in the polishing method using the same device as in the first process. A polishing method in which a rotating disk substrate 4 is clamped between polishers 5 held by holding plates 6 or a polishing method in which carriers 8 fitted with disk substrates 7 are clamped between polishers 9 held by holding plates 10 and the holding plates 19 and the carriers 8 are rotated can also be used. According to these methods, lugs generated in the first process can be removed without removing fine grooves on the surface of the substrate. |
