| 摘要 |
<p>PURPOSE:To enable obtaining a multi layer substrate superior in heat resistance in soldering, dimensional stability, etc., and superior in qualities such as no warps, by putting a plied member having an inner layer plate between outer members in a flexible hermetic container, and while reducing pressure in the container, raising the pressure of gaseous territory in which the container is set up and applying pressure to the plied member to complete its formation. CONSTITUTION:A stainless plate 4 is laminated on both sides of a plied member which is formed by laminating each member so as to form a required constitution, and the whole is inserted into a flexible container 5 and they are set up in a vessel 7. Then a vacuum deaeration apparatus 6 is connected to the flexible container 5 and deaerates it, and when sufficiently reduced pressure is obtained inside the flexible container 5, the inner pressure of the vessel 7 is raised working the vacuum deaeration apparatus 6. The plied member is pressurized together with the flexible container by the pressure of a gas 8, and each member is integrally formed. Here as the flexible container is tightly sticked to the outer wall of the contents, the pressure from the gas 8 is applied to the plied member without hindrance. Furthermore it is possible to directly obtain a multi layer substrate provided with an adhesives layer 3a for additive process as the outer most layer through a laminate forming process.</p> |
