| 摘要 |
PURPOSE:To realize a semiconductor device of higher quality and reliability and to improve bonding features by a method wherein the entire surface except a region whereat a lead frame metal may be exposed is covered by an insulating film. CONSTITUTION:An insulating film 4 is provided to cover the entirety except where the lead frame metal of a lead frame 1 needs to be exposed. The insulating film 4 covers the entire surface of the lead frame 1 not involving any electrical connection, with regions left uncovered for wire bonding sections 3 of inner leads 2 or chip mounting sections 6 for the wire bonding sections 3 of the inner leads 2 and an island 5. This improves a semiconductor device in quality and reliability during a manufacturing process because the inner leads 2 and bonding wires are protected from deformation that if any may cause them to contact other inner leads or islands to eventually cause short circuiting in semiconductor devices. An end of an inner lead 2 may safely be nearer to the island 5, which results in improved bonding features. |
