| 摘要 |
<p>PURPOSE:To improve device characteristics in total through trimming of resistors in hybrid integrated circuits positioned on both sides of a circuit substrate by a method wherein two probes capable of applying voltages and signals to the two hybrid integrated circuits, respectively, and two laser devices capable of irradiating the resistors in the two hybrid integrated circuits with laser beams, respectively, are provided. CONSTITUTION:The characteristics of hybrid integrated circuits C1 and C2 printed on a substrate 1 are adjusted through laser-trimming of resistors 5 printed on both sides of the substrate 1 while voltages and signals are applied to the hybrid integrated circuits C1 and C2. In such a functional trimming unit, probes 6 applying voltages and signals to the respective hybrid integrated circuits C1 and C2 on both sides of the substrate 1 are installed separated and independent from each other, and laser devices 7 projecting laser beams 4 on the resistors 5 are also installed separated and independent from each other. Source voltages or signals are applied to probing terminals 2 or external terminals 3 of the respective circuits C1 and C2 for the determi nation of the circuit behavior. The resistors 5 are subjected to trimming that is accom plished by the respectively laser beams 4, for the realization of desired total charac teristics in the circuits C1 and C2.</p> |
