| 摘要 |
PURPOSE:To form a resist pattern having superior adhesion on a substrate having a metallic copper layer formed on the surface by forming a film of a photosetting resin composition on the substrate by electrodeposition, imagewise irradiating rays of active light on the film and removing the unset parts of the film by development. CONSTITUTION:A substrate having a metallic copper layer formed on the surface is immersed in a coating bath for electrodeposition contg. a water-soluble or water-dispersible photosetting resin composition, and electric current is supplied with the substrate as the anode and the coating bath as the cathode to form a film on the substrate. The photosetting resin composition consists essentially of a product prepd. by neutralizing a polymer having carboxyl groups with alkali, an ethylenic unsatd. compound having at least one polymerizable unsatd. bond in one molecule and a photopolymn. initiator. The formed film is washed, dried and imagewise exposed by irradiating rays of active light from a light source such as a mercury lamp through a negative mask having a desired image. The unirradiated unset parts of the film are then removed by development to form a resist pattern made of a set resin film on the substrate. |
