| 摘要 |
PURPOSE:To protect a part lead sufficiently from being broken down by a method wherein an elastic stage is provided on the bottom of containing boxes arranged on a tape 1 at specified intervals. CONSTITUTION:A stage 6 is set up so that bubbles blown using a vinyl material may take a position at the level wherein the surface of semiconductor part 5 mounted on the stage 6 is slightly protruded beyond a box 3. In other words, when the semiconductor part 5 is put in an empty box 3, the surface of semiconductor part 5 is slightly protruded beyond the box 3. Next, when a cover 4 is laid upon the surface of semiconductor part 5 while slightly pressing down the surface of the same 5, the semiconductor part 5 is held by specified force given by the stage 6 and the cover 4. Through these procedures, the lead of semiconductor part 5 striding over the stage 6 can be protected from being broken down.
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