| 摘要 |
A filler compound for the spaces between the wires of a stranded conductor surrounded by and contacting a semiconductive layer which is surrounded by a layer of extrudced insulation, a method for filling such spaces with the compounds and an electric cable including such compound. The compound has a polymeric base, a Mooney viscosity at 100 DEG C. between 10 and 60 and a Shore A hardness between 10 and 90. Preferably, the compound includes hygroexpansible, water insoluble organic powder having particle sizes less than 200 microns and specified other characteristics. |
