发明名称 Process for forming deposited film.
摘要 <p>A process for forming a deposited film comprises the steps of: (a) arranging previously a substrate for formation of a deposited film in a film forming space; (b) forming a deposited film on said substrate by introducing an activated species (A) formed by decomposition of a compound (SX) containing silicon and a halogen and an activated species (B) formed from a chemical substance (B) for film formation which is chemically mutually reactive with said activated species (A) separately from each other into said film forming space to effect chemical reaction therebetween; and (c) exposing the deposited film growth surface to a gaseous substance (E) having etching action on the deposited film to be formed during the film forming step (b) to apply etching action on the deposited film growth surface, thereby effecting preferentially crystal growth in a specific face direction. s</p>
申请公布号 EP0241317(A2) 申请公布日期 1987.10.14
申请号 EP19870303225 申请日期 1987.04.13
申请人 CANON KABUSHIKI KAISHA 发明人 HIRAI, YUTAKA;SHIRAI, SHIGERU;MATSUYAMA, JINSHO
分类号 C23C16/24;C23C16/452;H01L21/205;(IPC1-7):H01L21/205 主分类号 C23C16/24
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