| 摘要 |
PURPOSE:To solder a semiconductor pellet excellently by scrubbing the semiconductor pellet, while melting solder by a hot jet. CONSTITUTION:A header 10 to which presoldering is completed is placed on a heating block 16 heated at approximately 350-360 deg.C while a semiconductor pellet 18 is sucked and held under a vacuum by a collet 20 and positioned to the header 10. A solder 12 section is supplied with N2 or N2+H2 or the hot air of argon gas at approximately 350-360 deg.C from a hot jet 22 and solder 12 is melted while scrubbing, a horizontal slight shock for rubbing, is applied in the direction rectangular to the direction of load, applying predetermined load to the collet 20. Accordingly, a gas existing in solder 12 is discharged to the outside, thus preventing the generation of voids, then soldering the pellet with high reliability. |
