发明名称 FIXING DEVICE FOR SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To contact-bond a radiator plate and a test element by providing a drive means for testing the test element provided with a heat sink plate, in which a magnet is buried, and a contact. CONSTITUTION:A permanent magnet 6 is buried in a radiator plate 3. A socket 4 conducting a connection to a test element 2 is mounted just under the test element 2. When the test element 2 is inserted to the socket 4, the test element 2 is sucked by the suction force of the permanent magnet 6 buried to the heat sink plate 3, and the test element 2 is fixed to the radiator plate by the action of the permanent magnet 6. The test element 2 is coupled with a circuit for drive in a printed circuit 5 under said state, and the characteristics of the test element 2 can be tested.
申请公布号 JPS62234358(A) 申请公布日期 1987.10.14
申请号 JP19860078575 申请日期 1986.04.04
申请人 MATSUSHITA ELECTRONICS CORP 发明人 TANABE TOSHIJI
分类号 H01L23/36;G01R1/04 主分类号 H01L23/36
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