| 摘要 |
<p>PURPOSE:To prevent the generation of breakings and cracks in chips by a method wherein a roller is pushed against the upper section of release paper, cracking is conducted along scribing lines, a wafer section is lifted from a lower section, each chip is separated mutually, release paper is cut and peeled by perforations and an intermediate liner is also peeled off. CONSTITUTION:Cracking is performed by using release paper 7' with perforations, the release paper 7' and an intermediate liner 6 are positioned on the upper surface of an expanding device body 1 as they are left as they are not peeled, and a cover 2 is closed. When a moving member 1a is shifted in the upper direction and a wafer section is lifted upward from the lower section of a tape 5, each chip in the wafer 4 is separated mutually along scribing lines 4a, the release paper 7' is cut along a perforation 7a, and the release paper 7' is peeled automatically from the tape 5 without peeling by a hand. Since the tape 5 is extended at that time, the sock liner 6 is also peeled together with the release paper 7', and the release paper in the external section of the perforation 7a is left as it is. Accordingly, the generation of the breakings and cracks of the chips can be prevented.</p> |
