发明名称 RESIN-SEALED SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the generation of an erroneous operation caused by a light of a semiconductor device by a method wherein, in the semiconductor device having the semiconductor element connected to the conductor on a film, the conductor is coated with the liquid resin in which a dyestuff is mixed, and the resin is hardened by heating. CONSTITUTION:The semiconductor element, connected to the conductor on an insulating flexible film, is provided at the aperture part punched out on the film. At that time, dyestuff-mixed liquid resin is coated on the conductor, and the liquid resin is hardened by heating. Dyestuff of black or blackish color, or dyestuff which is made black by mixing three primary colors of red, blue and yellow, is used as the above-mentioned dyestuff. As a result, the erroneous operation of the semiconductor device caused by the light can be prevented.
申请公布号 JPS62232946(A) 申请公布日期 1987.10.13
申请号 JP19860076112 申请日期 1986.04.02
申请人 HITACHI LTD 发明人 YOKOYAMA TAKASHI;OGATA MASAJI
分类号 H01L23/28;H01L23/29;H01L23/31;H01L23/552 主分类号 H01L23/28
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