发明名称 |
Laser soldering apparatus and method |
摘要 |
Fine wires are soldered without flux to solder pads on a flexible circuit of a workpiece by a laser. The laser beam is aligned and moved over the solder pad to describe a rectangle by movement of mirrors on a programmed, motor driven X-Y-Z linear table. Wires are deeply sunk into the solder pads by the weight of a cone brought against the wire carried by the X-Y-Z table. Vaporized insulation is restrained within the cone to maintain a clean microelectronic workpiece.
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申请公布号 |
US4700044(A) |
申请公布日期 |
1987.10.13 |
申请号 |
US19860892789 |
申请日期 |
1986.07.31 |
申请人 |
HUTCHINSON TECHNOLOGY INC. |
发明人 |
HOKANSON, JOHN M.;BENTZ, KENNETH S.;FIELD, TERRENCE G.;ZIEGLER, DAVID A. |
分类号 |
B23K1/005;B23K26/10;H05K1/18;H05K3/34;H05K13/06;(IPC1-7):B23K26/00 |
主分类号 |
B23K1/005 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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