发明名称 Apparatus and method for compensation of thermal expansion of cooling fluid in enclosed electronic packages
摘要 In an electronic package in which a fluid is encased to provide efficient thermal transfer between electronic components and cooling plate, the thermal expansion of the cooling fluid is compensated for by tubing in the enclosure. The tubing is vented to the atmosphere and as the cooling fluid expands, the tubing is compressed. The tubing is generally coiled within the chamber and can have a kink in the center region, dividing the tubing into two portions. Both portions of the tubing are vented to the external environment. In the preferred embodiment, surgical tubing is employed to compensate for the thermally induced changes in volume.
申请公布号 US4700272(A) 申请公布日期 1987.10.13
申请号 US19860879199 申请日期 1986.06.26
申请人 DIGITAL EQUIPMENT CORPORATION 发明人 BELLAMY, A. KEITH
分类号 H01L23/473;H05K7/20;(IPC1-7):H05K7/14 主分类号 H01L23/473
代理机构 代理人
主权项
地址
您可能感兴趣的专利