发明名称 HEAT-CURABLE BONDING FILM
摘要 PURPOSE:To provide the titled film having excellent heat resistance, flexibility and formability, by casting a compsn. consisting of a specified polyimide and a specified polymaleimide. CONSTITUTION:A polyimide varnish (A) obtd. by dissolving 90-50pts.wt. polyimide of formula I (wherein Ar is a bivalent group composed of a group of formula II and a group of formula III in a molar ratio of 10/90-50/50) is mixed with 10-50wt% polymaleimide (B) of formula IV (wherein R is a 2C or higher n-valent group; and n is not smaller than 2). The resulting varnish is cast on a glass plate, stainless steel sheet, etc. and dried to such an extent that the amount of the residual solvent is 1% or below.
申请公布号 JPS62232475(A) 申请公布日期 1987.10.12
申请号 JP19860076106 申请日期 1986.04.02
申请人 HITACHI CHEM CO LTD 发明人 MATSUURA SHUICHI;MIYADERA YASUO;KATO TOSHIHIKO
分类号 C09J7/00;C08G73/12;C08K5/34;C08L79/08;C09J179/08;H05K3/38 主分类号 C09J7/00
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