| 摘要 |
PURPOSE:To keep homogenety in etching even if change or difference is present in the contents of a wafer apttern and the like, by changing the radius of the revolution of the rotating wafer. CONSTITUTION:A wafer 11 is held with a holding member 7. A rotary body 2 is rotated with a driving device 6. Then, the holding member 7 starts revolution with a radius, which is a distance between an axial center 3 of the rotary body 2 and an axial supporting part, to which a supporting member 5 is attached, under the state the wafer 11 is held. At this time, a rotary device 8 is actuated, and an etching-liquid injecting device 9 is actuated. Then the wafer 11 undergoes etching, with the wafer 11 being revolved and rotated. When difference or change occurs in data such as the contents of a wafer pattern, coarse aud fine positional deviation of a semiconductor element, aud the size of the pattern; the attaching position of the supporting member 5 to the rotary body 2 or to the axial supporting part at a gear is changed. Thus the radius of the revolution of the a wafer is changed, and the radius of the revolution suitable for the contents of the pattern and the like is obtained.
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