摘要 |
PURPOSE:To simplify the constitution of a device, to enhance reliability of data and to obtain a stable image, by using a transparent material on the upper and lower parts of a spacer in an IC fixing device, obtaining the image of the IC with transmitted light from the upper direction, and sucking and fixing the IC with vacuum. CONSTITUTION:A hole is provided at the center of an upper glass plate 2. An IC fixing stage 3 is attached in the hole. A lower glass plate 2 is fixed to the upper glass plate 2 with a sapcer 4 in between. A pipe 6 is connected to a vacuum pump and used for fixing the IC with sucking pressure. The IC is mounted on the fixing stage 3. The IC is sucked and fixed with the vacuum. The IC image 1 is picked up by an image sensing camera 7 with transmitted light from the upper direction of this device. This device can be applied not only to the IC but to other electronic parts such as connectors, coils, transformers and capacitors. |