发明名称 IC FIXING DEVICE
摘要 PURPOSE:To simplify the constitution of a device, to enhance reliability of data and to obtain a stable image, by using a transparent material on the upper and lower parts of a spacer in an IC fixing device, obtaining the image of the IC with transmitted light from the upper direction, and sucking and fixing the IC with vacuum. CONSTITUTION:A hole is provided at the center of an upper glass plate 2. An IC fixing stage 3 is attached in the hole. A lower glass plate 2 is fixed to the upper glass plate 2 with a sapcer 4 in between. A pipe 6 is connected to a vacuum pump and used for fixing the IC with sucking pressure. The IC is mounted on the fixing stage 3. The IC is sucked and fixed with the vacuum. The IC image 1 is picked up by an image sensing camera 7 with transmitted light from the upper direction of this device. This device can be applied not only to the IC but to other electronic parts such as connectors, coils, transformers and capacitors.
申请公布号 JPS62232150(A) 申请公布日期 1987.10.12
申请号 JP19860074801 申请日期 1986.04.01
申请人 SEIKO EPSON CORP 发明人 YOKOTA RYUICHI;YODA TATSUO
分类号 H01L23/32;H01L21/683 主分类号 H01L23/32
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