发明名称 HEAT-RESISTANT RESIN COMPOSITION
摘要 PURPOSE:To form a resin composition markedly improved in heat resistance and being useful as a material for optical disk bases, by mixing a specified polyfunctional (meth)acrylate compound with an N-substituted maleimide and a radical polymerization initiator. CONSTITUTION:A polyfunctional (meth)acrylate compound of formula I (wherein R1 is a 2-50 C alcohol residue, R2 is H or CH3 and x is 2-6) is mixed with an N-substituted maleimide of formula II (wherein R3 is H or normal or iso CyH2y+1 and y is 1-12, provided that the iso isomer is one in which y>=3 or C6H5) and a radial polymerization initiator. It is desirable that the compound of formula I is bis(oxymethyl)tricyclo[5,2,1,0<2.5>]decane di(meth)acrylate and the N-substituted maleimide of formula II is used in an amount of 40wt% based on the total weight of the resin.
申请公布号 JPS62232415(A) 申请公布日期 1987.10.12
申请号 JP19860075739 申请日期 1986.04.02
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MATSUO TAKAHIRO;INOUE TAKAO
分类号 C08F220/20;C08F20/10;C08F22/36;C08F222/40;C08J7/04;G11B7/253 主分类号 C08F220/20
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