发明名称 DIE BONDING APPARATUS
摘要 PURPOSE:To shorten a bonding time per bonding, by providing a means for heating a pellet during a conveyance. CONSTITUTION:A pellet 1, which is conveyed with a catching device 5, is heated. Adequate bonding temperature is obtained with a heating means 8. A head part 8a of the heating means 8 is attached in the vicinity of the catching device 5. Hot air at the adequate temperature is blown and the pellet 1 is heated. The pellet 1 is supplied to a package 3 from a tray 2 and die bonding is continuously performed as in a conventional way. When the pellet 1 is catched in the tary 2, the head part 8a is lifted upward higher than the catching device 5 as shown in Figure (a), so that the part is not contacted with other pellet in the tray 2. During the conveyance, the head part 8a is lowered as shown in Figure (b), and the hot air is supplied to the surface of the pellet 1. when the pellet is transferred to the package 3, the head part 8a is lifted as shown in Figure (c) so that the part is not contacted with the package 3 as at the time of catching. The pellet is heated during the conveyance.
申请公布号 JPS62232131(A) 申请公布日期 1987.10.12
申请号 JP19860076147 申请日期 1986.03.31
申请人 MITSUBISHI ELECTRIC CORP 发明人 OSEDO JIRO
分类号 H01L21/52 主分类号 H01L21/52
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