| 摘要 |
PURPOSE:To simplify programming at the NC part of a bonding apparatus and to shorten bonding time, by moving a bonding pin only in one direction. CONSTITUTION:A capillary is moved to X1. With this point as a starting point of interconnection, a piece of bonding wire is bonded to a lead frame. Then, the capillary is moved to X2. With this point as a terminating point, the bonding wire is bonded to a bonding pad. Then, the capillary is moved to X3. With this point as a starting point of interconnection, interconnection to X4 is performed. Since X1. X4 are located on the same straight line, X1 and X2 and X3 and X4 are connected only by the movement of the capillary in the directions 2. When the connection at the point X4 with the capillary is finished, the entire body is moved in the direction of 1, and X5 is moved to the point of X1. Then, with X5 as a starting point of interconnection, the same movement is performed, and the interconnection is carried out. The capillary is moved in the directions of 2 with X1 as the absolute starting point of the capillary. Then the entire body is moved in the direction of 1. Thus a semiconductor chip and the lead frame are connected. |
