| 摘要 |
PURPOSE:To separate two places sticking close to surfaces each other smoothly from a plate peripheral part of one side, by installing a device which forms a closed space and charges air to the closed space and pressurizes it. CONSTITUTION:An interval between a mask holder 2 and a wafer chuck 4 is made to adhere to each other in a way of suction by a pipe line C exciting in the wafer chuck 4 for separating a mask 1 and a wafer 3 from the sticking state, setting the space E surrounded by this adherence down to a closed chamber. Next, this closed chamber E is pressurized by a pipe line D existing in the mask holder 2. When the closed chamber E is pressurized, the mask 1 is deformed from its perimeter, sticking to this chamber E whereby the water 3 clamped by suction to the wafer chuck 4 is going to separate from the perimeter by deformation of the mask 1. When the mask 1 and the wafer 3 are completely separated or in the midway of separation, suction force of the pipe line C is released, and furthermore the wafer chuck 4 is mechanically separated from the mask holder 2 whereby separation of the mask 1 and the wafer 3 is over.
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