发明名称 GLASS FOR LOW-TEMPERATURE BONDING
摘要 PURPOSE:The titled glass, consisting of PbO, WO3 and B2O3 of specific composition, having high resistance, improved abrasion resistance and consistency with thermal expansion coefficient of ferrite. CONSTITUTION:50-89wt% PbO is blended with 1-15wt% WO3, 10-49wt% B2O3 and, as necessary, 1-10wt% at least one selected from SiO2, Al2O3, CaO, SrO, MgO, BaO, P2O5 and GeO2 and the resultant blend is melted while heating to give a glass melt. A dried inert gas containing F is then blown into the glass melt to adjust the contents of water and OH groups to <=500ppm. Thereby the aimed glass for low-temperature bonding capable of sealing at a temperature as low as about 300 deg.C and improving reliability, e.g. joining of magnetic heads, sealing of LSI packages, etc., and having a resistance as high as 1X10<15>OMEGA.cm is obtained.
申请公布号 JPS62230647(A) 申请公布日期 1987.10.09
申请号 JP19860072969 申请日期 1986.03.31
申请人 TOSHIBA CORP 发明人 KOBAYASHI KEIJI
分类号 C03C3/072;C03C3/14 主分类号 C03C3/072
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