发明名称 METHOD FOR PLATING ALUMINUM SUBSTRATE
摘要 PURPOSE:To form a metallic layer having superior adhesion on the cleaned surface of Al by plating by subjecting the Al to zinc substitution plating, ununiform surface roughening with an alkaline soln., treatment with an acidic soln., zinc substitution plating, treatment with an acidic soln. and electroplating. CONSTITUTION:The surface of an Al member is cleaned by degreasing and pickling. The member is subjected to zinc substitution plating with a plating soln. contg. NaoH, Rochelle salt and ZnO. The member is then immersed in the alkaline plating soln. or aqueous alkali soln. contg. 10-550g/l NaOH to finely roughen the surface by ununiform etching. The deposited surface zinc layer is further treated with a strong acid or ammonium persulfate and the member is subjected again to zinc substitution plating. The deposited zinc layer is treated with an acid and finally electroplating is carried out to form a Cu layer having high adhesion on the surface of the Al member.
申请公布号 JPS62230996(A) 申请公布日期 1987.10.09
申请号 JP19860073830 申请日期 1986.03.31
申请人 HITACHI CHEM CO LTD 发明人 TSURU YOSHIYUKI;OKAMURA TOSHIRO
分类号 C23C18/31;C25D5/44 主分类号 C23C18/31
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