发明名称 DEVICE FOR SPUTTERING MAGNETRON
摘要 PURPOSE:To optionally change composition ratio of an alloy thin film by transferring a permanent magnet within a plane parallel to the face of a divided target plate by means of a driving mechanism. CONSTITUTION:A target plate 3 is fitted to one side face of a housing 4 for a target which is opposed to a base plate 2. A permanent magnet 5 is provided to the rear face side of the target plate 3. A rotary shaft 6 is fitted to the rear face of this magnet 5 in an eccentric position. The other end of the rotary shaft 6 perforates the wall of the housing 4 and a motor 7 is connected to the projecting end thereof via a driving gear 9. The target plate 3 is divided into materials A, B. When rotating the rotary shaft 6, the magnet 5 is eccentrically rotated and an evaporation source on the surface of the target plate 3 is made to a doughnut-like, and a thin film wherein the ratio of alloy composition is continuously changed by means of the position of the magnet 5 is formed.
申请公布号 JPS62230971(A) 申请公布日期 1987.10.09
申请号 JP19860074850 申请日期 1986.03.31
申请人 SHIMADZU CORP 发明人 UEDA EISUKE;NISHIO SUSUMU
分类号 C23C14/36;C23C14/34;C23C14/35 主分类号 C23C14/36
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