发明名称 INTERCONNECTION SYSTEMS FOR ELECTRICAL CIRCUITS
摘要 <p>Electrical circuits can be built up in three dimensions by using spacers (20, 20') which interlock together to define stacks. Stacks can be used to clamp together chip carriers between adjacent spacers or to provide power and signal transmission stacks (120) which have a number of continuous tracks (110). Link members (126, 128) are used to provide electrical connection means between the chip carriers in the chip carrier stacks and the tracks of the power and signal transmission stacks.</p>
申请公布号 WO1987006092(A1) 申请公布日期 1987.10.08
申请号 GB1987000203 申请日期 1987.03.24
申请人 发明人
分类号 主分类号
代理机构 代理人
主权项
地址