MANUFACTURE OF HIGH DENSITY WIRING BOARD IN WHICH INSULATED WIRES ARE USED FOR NECESSARY WIRING PATTERNS

摘要

A high-density wired circuit board obtained by providing an auxiliary grid at the position of centroid of a main grid and by employing wiring in the inclined direction mainly instead of wiring in the XY directions mainly can make the space between wires and through-holes large without narrowing a wiring pitch.