METIOD OF FORMING MARK ON SEMICONDUCTOR CHIP

摘要

PURPOSE:To provide marks at different positions of chips which are formed by dividing a wafer into the same shape efficiently by a method wherein a mask pattern in which patterns are arranged with a different pitch from the pitch of the chips is transcripted on the chips. CONSTITUTION:Coordinates graduation patterns 2 are arranged in 1st mask 1 with a pitch of 5000 mum. One graduation length of the coordinates pattern is 10 mum. This is the same as the pitch of the patterns on chips 8.The coordinates graduation patterns 2 are transcripted on semiconductor chips 8. The pitch of dots arranged on 2nd mask 3 is 5010mum. The mask patterns (dots 4) are transcripted on the chips. Marks (dots 5) are formed on the respective chips 8 at the positions different from each other and the respective positions on a semiconductor substrate 6 are indicated. For making the mask 3, one reticle is sufficient. Therefore, the manufacturing cost of the mask can be reduced. This is the same as the pitch of the patterns on chips 8.