| 摘要 |
PURPOSE:To enable formation of a high temperature solder alloy layer directly on the oxide film of a metal cilicide by a method wherein a flux of boracic acid or hydrofluoric acid is applied on the metal cilicide, and the high temperature solder alloy mainly consisting of zinc is heated to he molten on the flux thereof. CONSTITUTION:A flux of boracic acid or hydrofluoric acid is applied at first on a thermoelectric element l, high temperature solder mainly consisting of zinc and one end of the above-mentioned lead wire 3 are put on the applied layer thereof, and by heating the flux and the high temperature solder thereof up to be molten, formation of a solder alloy layer 2 and soldering of the lead wire 3 can be realized. According to this method, the solder alloy layer of zinc having a high melting point can be formed according to usual soldering technique without using a special soldering device, and accordingly, the lead wire can he joined directly to the metal cilicide through the solder alloy layer thereof.
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