发明名称 DEPOSIT FILM FORMING METHOD
摘要 PURPOSE:To form the deposit films with high quality securing the evenness of electrical and optical properties and the stability of quality even in case of forming thick and hardly peeling off deposit films over broad space by a method wherein the stay time and atmosphere temperature of a gaseous material in a deposit chamber are specified. CONSTITUTION: A gaseous material represented by a general formula of AaHbXc (A: Si,Ge,Sn X: halogen atoms a,b,c: positive integer a >=2, c not equal to O) led into a deposit chamber is supplied with thermal energy to form a deposit film on a support mounted in the deposit chamber. At this time, the stay time t of gaseous material in the deposit chamber is specified to be 0.01 sec <=t<=50 sec, likewise the atmospheric temperature T to be 200 deg.C<=T<=1000 deg.C, the product of stay time t and the atmospheric temperature T to be 50 sec<=Tt<=3000 deg.C sec. Through these procedures, the deposit films with even physical properties can be formed over broad space.
申请公布号 JPS62229824(A) 申请公布日期 1987.10.08
申请号 JP19860071974 申请日期 1986.03.28
申请人 CANON INC 发明人 SAITO KEISHI;MURAKAMI TSUTOMU
分类号 H01L31/04;H01L21/205 主分类号 H01L31/04
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