| 摘要 |
PURPOSE:To automate the resin sealing process with excellent mass productivity by a method wherein dams are formed of thixotropic resin with the viscosity suitable for completely covering the peripheral part of a substrate without flowing out of the substrate on the peripheral part of substrate on the part mounting side of a hybrid IC to fill the inside with fluid resin in low viscosity for completely sealing the mounted parts and forming circuit. CONSTITUTION:Dams 16 are formed of a thixotropic resin with the viscosity suitable for completely covering the peripheral part of a substrate 11 without flowing out of the substrate 11 e.g. a silicon resin17. A specified amount of fluid resin in low viscosity e.g. the resin region 17 is discharged from a dispenser 15 etc. At this time, if the viscosity and fluidity is properly selected, the resin 17 only left as it is flows between and under the mounted parts 12 to completely seal the mounted parts 12 and forming circuit with itself. Furthermore, the fluid resin can not flow out of the substrate 11 due to the dams 16 formed on the ends thereof. |
