| 摘要 |
A device for vertical mounting of semiconductor components, especially transistors. This device, which consists of plastic, is used for vertical mounting of semiconductor components, especially transistors (9), if no heat sink is required for the component. The device has a narrow, box-shaped body (1a) whose lower narrow side (1b) is used for mounting on a printed circuit board (10) and whose front broad side (1c) is used for fastening a transistor (9). For this purpose, at least one hole (4; 2, 3) is in each case provided, for accommodating fastening screws (11, 12) both in the lower narrow side and in the front broad side. Pins (5, 6) are integrally formed on the lower narrow side (1b) to provide rotation protection. This results in a highly stable arrangement of semiconductor components on printed circuit boards, with connecting wires (13) which are free of tension. <IMAGE>
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