| 摘要 |
PURPOSE:To obtain a vertical housing jig which facilitates satisfactory diffusion processing, thin film formation and so forth by a method wherein wafer supporters are so constituted as to be able to be separated along the direction of the separation of supporting planes. CONSTITUTION:The supporters 3A and 3B of a vertical housing jig can be separated along the direction of the separation of supporting planes 10. A semiconductor wafer 1 is inserted and placed onto the supporting plane 10 from the side of separated open planes 31 of the supporters 3A and 3B and then the separated open planes 31 are made to touch each other to position and support the semiconductor wafer 1. In this state, ring shape fixing members 6 and 7 are applied to the external circumference 4a of a base and the external circumference 5a of a plate-shape member s to fix the supporters 3A and 3B solidly, As the semiconductor wafer 1 is tightly fitted to the stepped supporting plane 10, off-centering does not occur. With this constitution, uniform and satisfactory diffusion processing, thin film formation and so forth can be facilitated over the whole surface of the semiconductor wafer.
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