发明名称 METHOD AND APPARATUS FOR POSITIONING SEMICONDUCTOR WAFER
摘要 PURPOSE:To position a semiconductor wafer highly accurately' by driving facing belts in the reverse directions as a set unit for two sets of the belts, thereby rotating the semiconductor wafer, monitoring and detecting the arrival of the position of the orientation flat at a specified position, and stopping the driving of the belts. CONSTITUTION:Semiconductor wafers 2 are sequentially mounted on a first conveying belt 6 and a second conveying belt 7 and conveyed. The movement of the wafer 2 is stopped at a delibery part 12 between both conveying belts 6 and 7 by a stopper 3. The wafer 2 is roughly positioned at first. As the movement is stopped, the near ends of endless belts 6a, 6b, 7a and 7b forming the first conveying belt 6 and the second conveying belt 7 are lifted and the endless belts are turned in the reverse directions. Then the semiconductor wafer 2 is rotated. When a sensor 5, which is attached to a wafer guide 13, detects an orientation flat 2a, the turning of the belts is stopped. The upward movement of the belt end parts is released. The wafer guides 13 and 13' are further brought closer and contacted to the semiconductor wafer 2. Thus the positioning is performed more accurately.
申请公布号 JPS62229851(A) 申请公布日期 1987.10.08
申请号 JP19860070850 申请日期 1986.03.31
申请人 TOSHIBA CORP 发明人 NISHIGAKI HISASHI
分类号 H01L21/68;H01L21/67 主分类号 H01L21/68
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