| 摘要 |
PURPOSE:To obtain a hybrid integrated circuit module having excellent convertibility in IC chips, superior moisture vapor resistance and high reliability by hermetically sealing the IC chips by mini-caps at every one or several piece and packing the IC chips by molds with a resin. CONSTITUTION:IC chips 1 are mounted onto a substrate 3, the IC chips are hermetically sealed in He or N2 gas in order to prevent the oxidation of the IC chips by mini-caps 7 consisting of plastics, ceramics or the like at every small number such as one or two or three, and the outer surfaces of the mini-caps 7 are packed by molds with a resin 6 and sealed. When a defective IC chip is generated, a mold pack and a hermetic seal on the section of the defective IC chip are removed, and the IC chip can be exchanged easily. |
