| 摘要 |
Using a single mask pattern on a semiconductor substrate, a doped base contact region adjacent to the surface of the substrate, a buried insulating region below the base contact region, and an insulating layer on the base contact region, and optionally, a metal or metal silicide base-electrode-taking-out layer on the base contact region, are formed, respectively. Doped emitter and intrinsic base regions are formed below the mask pattern. A collector region is defined by the base contact region and the buried insulating layer to be inside thereof, i.e., below the mask pattern. Thus, a bipolar transistor is formed in a size that is essentially necessary, thereby reducing the collector-base capacitance, the base resistance, and the size of the device.
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