发明名称 ORGANIC SOLDER
摘要 PURPOSE:To uniformly supply solder and to prevent short circuiting by constituting the org. solder of maleic rosin or fumaric rosin and the salt of tin and lead and specifying the content of metallic tin and metallic lead to specific weight % or above. CONSTITUTION:The org. solder is constituted of the rosin deriv. of the maleic rosin or fumaric rosin and the salt of tin and lead. The content of the metallic tin in the solder is compounded to >=12% and the content of the metallic tin therein to >=4%. The salt substantially contg. tin and lead can be obtd. by adding the salt of tin and lead to the alkaline salt of the rosin deriv. and subjecting the same to double decomposition. The tin salt and lead salt of the rosin deriv. are decomposed to form the molten solder alloy when such org. solder is heated to 300-400 deg.C. Joining of metals is thus executed. Since the formation of the liberated metallic particles is prevented, the solder is uniformly supplied and the short circuiting is prevented.
申请公布号 JPS62227593(A) 申请公布日期 1987.10.06
申请号 JP19860072044 申请日期 1986.03.28
申请人 HARIMA CHEM INC;OHARA KINZOKU KOGYO KK 发明人 KONO MASANAO;SUMIYOSHI EIJI;ARIMOTO KUNIO;MIZUTA TATSUJI;OBARA KAZUAKI;OBARA SHINSUKE
分类号 B23K35/22;B23K35/14;B23K35/36;B23K35/363 主分类号 B23K35/22
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