LIQUID-COOLING MODULE SYSTEM FOR ELECTRONIC CIRCUIT COMPONENTS

摘要

LIQUID-COOLING MODULE SYSTEM FOR ELECTRONIC CIRCUIT COMPONENTS A printed circuit board assembly having a printed circuit board mounting, on both faces, heat generative electronic circuit components, such as integrated circuit chips, and a pair of liquid-cooling modules arranged on both sides of the printed circuit board. Each of the liquid-cooling modules is provided with a liquid cooling plate having liquid coolant supply heads and a plurality of resilient heat transfer units held by the liquid-cooling plate and arranged in compression contact with the electronic circuit components on both faces of the printed circuit board.