发明名称 |
Resin-molded semiconductor device |
摘要 |
A resin-molded semiconductor package device includes a plurality of grooves which are spaced a predetermined distance from each other in the edge portions defined by the main surface and the side surfaces of the main body of a resin-molded package, which grooves correspond to a plurality of external leads. The external leads are folded, the tips of the external leads are positioned in the grooves, and the middle portions of the external leads are located above the main surface of the package so that a predetermined standoff distance is maintained between the middle portions of the external leads and the package.
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申请公布号 |
US4698660(A) |
申请公布日期 |
1987.10.06 |
申请号 |
US19860833535 |
申请日期 |
1986.02.12 |
申请人 |
FUJITSU LIMITED |
发明人 |
KUBOTA, AKIHIRO;AOKI, TSUYOSHI;ONO, MICHIO;SUGIURA, RIKIO |
分类号 |
H01L23/50;H01L23/28;H01L23/31;H01L23/495;H05K3/34;(IPC1-7):H01L23/50;H01L23/00 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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