发明名称 SOLDERING METHOD
摘要 PURPOSE:To remove the gas containing a molten solder and to make the soldering part in the good quality without a pin hole defect, etc. by executing the soldering in a nonoxidizing state, by making the solder in a vacuum chamber in a vacuous state and by replacing with an inert gas in succession. CONSTITUTION:No gas state is made by releasing the containing gas in a vacuum state with a valve 33 of the molten solder of the solder tank 15 located inside a vacuum chamber 14. The replacement is in succession performed by feeding an inert gas inside the chamber 14 from a valve 35. The printed circuit board P transferred by a conveyor 21 is dried by a heater 13 after sticking a flux with a foaming type fluxor 12. The soldering of good quality without any pin hole nor void is in succession performed in a nonoxidizing state in a jet type solder tank 15 by being transferred to a conveyor 23 from an open gate 22. It is cooled by a fan then by being carried out to a conveyor 25 from an open gate 24.
申请公布号 JPS62227572(A) 申请公布日期 1987.10.06
申请号 JP19860069157 申请日期 1986.03.27
申请人 TAMURA SEISAKUSHO CO LTD 发明人 MASUDA TSUGUNORI;ABE NOBUHIDE;OKANO TERUO
分类号 B23K31/02;B23K1/00;H05K3/34 主分类号 B23K31/02
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