| 摘要 |
PURPOSE:To obtain a device having good heat emission properties, by providing a metallic wiring layer on a metallic substrate through an electrically insulating thin ceramic film, forming a part of the wiring layer of a metal which is not wetted by a solder and soldering an electric element thereon. CONSTITUTION:A thin Al2O3 film 2 is provided on a Cu substrate 1, and a wiring layer 3 of a material wettable by solder of Ni or the like is formed thereon in a predetermined pattern. A solder layer 5 is provided only on a region of the Ni layer 3 where a semiconductor element 4 is to be arranged. The element 4 is bonded thereto and connected with a bonding wire 6. Such construction enables heat generated during operation of the device to be dissipated efficiently and enables the device to be highly integrated.
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