| 摘要 |
PURPOSE:To obtain a resist having superior developability and dimensional accuracy as well as superior electric characteristics, general purpose heat resistance and moisture resistance, etc., by forming a solder resist from a specified partially (meth)acrylated epoxy resin, specified reaction products, photosensitizer, and a heat curing agent. CONSTITUTION:Partially (meth)acrylated cresol novolak type epoxy resin contg. 0.3-0.8 equiv. (meth)acrylic acid basing on 1 epoxy equiv. of the cresol novolak type epoxy resin, and a reaction product between diisocyanate trimer contg. at least three isocyanate groups and at least one isocyanure ring and a compd. having at least two (meth)acryloyl groups and at least one OH group, is incorporated into a solder resist as its essential components. The resist can be cured easily by heating or irradiation with light after it is coated on a substrate. The developability in the image forming stage is also superior. |
