| 摘要 |
PURPOSE:To obtain a polyimide resin having excellent mechanical characteristics, adhesivity and solubility and low cure shrinkage and suitable for an interlaminar insulation film of a multi-layer semiconductor circuit, by heating a specific amic acid. CONSTITUTION:The objective polyimide resin can be produced by heating an amic acid of formula I (R' is siloxane; R'' is tetravalent aromatic residue) preferably at 250-350 deg.C. The amic acid of formula I can be produced by (1) reacting (A) one or more kinds of siloxane compounds of formula II [e.g. 1,3-bis(3- aminopropyl)-1,1,3,3-tetramethylsiloxane] with (B) a tetracarboxylic acid dianhydride of formula III (e.g. 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride) at a molar ratio of 1:2 in a polar solvent and (2) reacting the reaction product with an ethynylaniline compound of formula IV (e.g. 2- ethynylaniline).
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