| 摘要 |
PURPOSE:To obtain an LED with low manufacturing cost and high reliability by a method wherein an LED chip is bonded to the top of one of a pair of external leads fitted in cavities provided in a resin package and sealing resin is applied to the light emitting plane of the resin package. CONSTITUTION:An LED lamp is constituted by a resin package 1, a pair of external leads 3 which are fitted in cavities 2 provided in the resin packrage 1, an LED chip 4 which is bonded to one of a pair of the external leads 3, a lead wire 5 which is connected between the LED chip 4 and the other external lead 3 and sealing resin 7 applied to the light emitting plane of the resin package 1. The resin package 1 is, for instance, composed of cylindrically injection- molded white polycarbanate resin and a tapered reflective plane 6 is provided on the circumference of its top surface to reflect the light emitted by the LED chip 4 upward. Then the sealing resin 7 composed of double-liquid type transparent epoxy resin is applied to the top surface of this package to protect the LED chip 4 and the lead wire 5. |
