| 摘要 |
PURPOSE:To obtain an economical high-frequency power amplification module which does not allow generation of warpage in the entire part and crack of ceramics and assures high performance and high reliability by providing an earth conductive layer in a ceramic substrate, a plurality of circuit conductors which are partly connected to the earth conductive layer and a semiconductor chip is mounted on the desired circuit conductor. CONSTITUTION:A ceramic substrate 11, an earth conductive layer 12 provided within such ceramic substrate 11, a plurality of circuit conductors 13 provided at the surface of substrate 11 and are partly connected to the earth conductive layer 12 and a semiconductor chip 15 mounted on the desired circuit conductors among these circuit conductors are provided. For instance, said ceramic substrate 11 is formed by a material of aluminum nitride and the earth conductive layer 12 and circuit conductor 13 are formed by tungsten and the earth conductive layer 12 and circuit conductor 13 are formed by the baking simultaneously with that of the ceramic substrate 11. Thereby, since it is no longer necessary to joint a heat sink and ceramic with the solder as is done existingly, problems such as warpage or cracks in the whole part can be eliminated. |
