发明名称 PROCESSING DEVICE COMBINEDLY USING LASER
摘要 PURPOSE:To provide the titled device which can process a work uniformly over the entire surface by constituting the device in such a manner that laser light is horizontally irradiated on the work immersed in a working fluid under circulation and that the processing part is pulled up onto the working fluid according to the progression of the processing of the work. CONSTITUTION:An etching liquid which is the working fluid is circulated 12 and after the etching liquid in a liquid vessel 11 is adjusted to a prescribed temp., the work W attached to a pulling up device 20 and supported by a supporting part 21 is immersed into the etching liquid in the liquid vessel 11. The laser light L oscillated form a laser oscillator 24 is irradiated horizontally to scan the prescribed part of the work W via a pair of reflecting mirrors 25, 26, a condenser lens and a laser light irradiation window 23. The irradiation part is heated to a prescribed temp. and the prescribed part is selectively etched at a high speed. The device 20 pulls up the work W in such a manner that the part subjected to the processing is successively emerged to the outside of the liquid according to the progression part exposed on the surface of the etching liquid is removed by the heating air blown by an air blower 32.
申请公布号 JPS62224688(A) 申请公布日期 1987.10.02
申请号 JP19860065952 申请日期 1986.03.26
申请人 TOSHIBA CORP 发明人 MORITA NOBORU;ISHIDA SHUICHI
分类号 C23F1/02;B01J19/12;B23K26/12;C23C18/14;C23F1/00;C23F4/04 主分类号 C23F1/02
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