| 摘要 |
PURPOSE:To manufacture an Al alloy for lead frame excellent in strength, hardness, and bendability after thermal hysteresis at a low cost, by incorporating specific percentage of Mg, Zn, Cu, Mn, Cr, Zr, V, and Ti to Al. CONSTITUTION:An Al alloy consisting of, by weight, 3.0-6.0% Mg, 0.5-2.0% Zn, 0.1-0.5% Cu, >=1.2% in total, of 1 or >=2 kinds among 0.20-1.0% Mn, 0.05-0.30% Cr, 0.05-1.0% Zr, 0.05-0.20% V, and 0.01-0.15% Ti, and the balance Al with impurities is prepared. In this way, the Al alloy for lead frame suitable for use in devices such as IC, etc., using a semiconductor as an element can be obtained.
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