| 摘要 |
<p>PURPOSE:To improve cooling efficiency by pushing a semiconductor chip by a pan-shaped leaf spring and thermally connecting a refrigerant and the semiconductor chip. CONSTITUTION:Pan-shaped leaf springs 11 being in contact directly with a refrigerant are interposed to one parts or the whole surfaces of joint surfaces among a cooling section 6 and semiconductor chips 2 or a semiconductor-chip loading substrate 1 or a semiconductor device, thus efficiently dissipating the heat of the semiconductor chips 2 to the cooling section 6. The pan-shaped leaf springs 11 are interposed to one parts or the wholes of joining sections among the base section 12 of the cooling section and the semiconductor chips 2 or the semiconductor device in the joining sections, thus adjusting an error section by elastic bodies 13 even when the precision of joining among the semiconductor chips 2 or the semiconductor device and the base section 13 is not improved too much. Accordingly, cooling efficiency is enhanced.</p> |
