| 摘要 |
PURPOSE:To facilitate mounting to a substrate, etc., and to miniaturize a photosensor by loading a light-emitting element pellet and a light-receiving element pellet onto one lead frame and sealing a light-emitting section for the light-emitting element pellet and a light-receiving section for the light- receiving element pellet into one package. CONSTITUTION:A light-emitting element pellet 3 and a light-receiving element pellet 4 are mounted and bonded to a lead frame 2 connected in a sheet by a reinforcing section 1, a light-emitting section 6 and a light-receiving section 7 are sealed and molded to one package by a resin 5, and beams from the light-emitting element pellet 3 are converged efficiently to the light-receiving element pellet 4 by a reflecting plate 8 and lenses 9. The reinforcing section 1 is removed after the completion of molding, thus manufacturing a finished product. The light-emitting section and the light-receiving section are constituted of one lead frame, thus forming the product in SIP structure, then facilitating mounting to a substrate, etc. |
