发明名称 BONDING GLASS COMPOSITION
摘要 PURPOSE:To develop a bonding glass composition for dielectrics having improved airtightness and bonding strength, by blending specific amounts of PbO with Bi2O3, SiO2, Na2O and K2O, melting the resultant blend, cooling and finely pulverizing the blend. CONSTITUTION:Given amounts of PbO or Pb3O4, Bi2O3, KNO3 and NaNO3 are prepared and blended and the resultant blend is heated at 800-900 deg.C for 1-2hr and melted. The melt is then stirred, homogenized and cast on a clean iron or carbon plate and air-cooled. The cooled blend is then finely pulverized in an alumina mortar, etc., to give powder having 1-3mum average particle diameter. Thereby the aimed bonding composition having composition of 18-75wt% PbO, 15-80wt% Bi2O3, 0.2-14wt% SiO2 and 0-6wt% total of Na2O and K2O is obtained. The composition is added to a dielectric composition in producing laminated ceramic condensers, etc., to remarkably improve the adhesion to ceramic substrates.
申请公布号 JPS62223039(A) 申请公布日期 1987.10.01
申请号 JP19860062499 申请日期 1986.03.20
申请人 SHIZUOKA UNIV 发明人 TAKASE HIROSHI;IMOTO FUMIO
分类号 C03C3/07;C03C8/24;C09D1/00;C09J1/00;H05K1/16 主分类号 C03C3/07
代理机构 代理人
主权项
地址