发明名称 COMPOSITION FOR RESIN BONDING
摘要 PURPOSE:To obtain the titled composition which neither erodes nor causes failure of an adherend (resin) and has excellent (initial) adhesiveness, by mixing a liquid diene polymer containing hydroxyl groups, a polyisocyanate compound, a moisture absorbent, and an inorganic filler and/or a polyol compound. CONSTITUTION:100pts.wt. liquid diene polymer (A) which contains 0.1-10meq/g of hydroxyl groups preferably at the end of its molecular chain and has a number-average molecular weight of 300-25,000 is mixed with a polyisocyanate compound (B) (e.g., tolylene diisocyanate) in an amount sufficient to provide a molar ratio of NCO to OH of 0.2-25.0 based on the hydroxyl group of component A, 5-50pts.wt. moisture absorbent (C) such as a synthetic zeolite, 1-1,000 pts.wt. inorganic filler (e.g., silica) and/or 1-1,000pts.wt. polyol compound (e.g., N,N'-bis-2-hydroxypropylaniline) (D), and if necessary, 1-1,000pts.wt. polyamine compound (E) (e.g., hexamethylenediamine) as reinforcing agent.
申请公布号 JPS62223286(A) 申请公布日期 1987.10.01
申请号 JP19860064988 申请日期 1986.03.25
申请人 IDEMITSU PETROCHEM CO LTD 发明人 YASUYOSHI MATSUNORI;SAKUMA KAORU
分类号 C09J175/04;C09J175/00 主分类号 C09J175/04
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